Abstract
We introduce a new thick-layered, etched-contact a-Si:H TFT (TLEC-TFT) structure which allows the use of thick a-Si:H layers without increasing the TFT contact resistance. This device facilitates the integration of high-performance TFTs and thick-layered photo-transistors in a-Si:H-based image sensors. The TLEC-TFT is fully compatible with the conventional TFT fabrication process and requires no extra masking steps. For low values of the drain-to-source voltage, our new TFT boosts the linear region current by two orders of magnitude over that of conventional TFTs with identically thick a-Si:H layers. By removing the adverse effects of contact resistance in transistors with thick a-Si:H layers, our TLEC-TFT design allows us to compare the performance of TFTs with thick and thin a-Si:H layers. We find that the width of the conduction-band tail decreases in thick-layered a-Si:H TFTs. This reduction in the width of the band tails results in an increase in the TFT mobility and subthreshold slope. Consequently, thick-layered, etched-contact TFTs possess higher overall current-drive capabilities compared to conventional, thin-layered TFTs. We present experimental evidence which correlates the width of the conduction-band tail to the density of as-deposited free carriers.
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