Thick film modules assembled to flexible printed circuits

Abstract

The creation of a basic concept for the safe connection of various technologies of electronic packaging to a great final overall structure mix will be more important in the next years. Due to the increasing demands, it is clear, that all incumbent solutions of the packaging will use the advantageous properties for a total hybrid concept. To ensure the reliability of such a solution, we have to guarantee a reliable interface between the various technology concepts with the practical constructions. Consideration of existing standards and tools of quality management is to integrate. The landscape and process necessary for evaluation methods are fully present and potential problem areas are the basis of practical studies show. The task is an example of the area array connection between the flexible printed circuits and the assembled thick film modules in different geometrical dimensions. So we used different geometries in the pitch and different joining technologies in the manufactured thick film modules. We made some investigations with our manufactures thick film modules, which we assembled on polyimide substrates. During the characterization during accelerated test methods we obtained a lot of interesting data about this technology combination. We describe our methods for manufacturing of samples, the test methods and our final view to the results. The use of flexible flat cables (FFC) and flexible printed circuits (FPC) constantly increases in the next years. The development of competitive products can be improved on basis of these technologies. The advantages within the range reliability and costs could be used however only with the consideration of a complete view of the entire process chain efficiently and trend-setting.