Thermosiphon: a thermal aware NUCA architecture for write energy reduction of the STT-MRAM based LLCs

Abstract

As the speed gap of the modern processor and the off-chip main memory enlarges, on-chip cache capacity increases to sustain the performance scaling. As a result, the cache power occupies a large portion of the total power budget. STT-MRAM (Spin Transfer Torque Magnetic Memory) is proposed as a promising solution for the low power cache design due to its high integration density and ultra-low leakage. Nevertheless, the high write power and latency of STT-MRAM become new barriers for the commercialization of this emerging technology. In this paper, we investigate the thermal effect on the access performance of STT-MRAM and observe that the temperature can affect the write delay and energy significantly. Then, we explore the NUCA (Non-Uniform Cache Access) design of the CMPs (Chip-Multi-Processors)with STT-MRAM based LLC (Last Level Cache). A thermal aware data migration policy, called Thermosiphon, which takes advantage of the thermal property of STT-MRAM, is proposed to reduce the LLC write energy. This policy splits the LLC into different regions based on the thermal distribution and adaptively migrate write intensive data considering the temperature gradient among different thermal regions. Compared to the conventional NUCA design, our proposed design can save 22.5% write energy with negligible hardware overhead.