Abstract
Silver-loaded epoxy is the conventional component attach material used in microwave hybrid assemblies. Conductive thermoplastic adhesives offer several significant advantages over epoxies for component attach including much shorter bond time and faster rework. The suitability of a silver-loaded thermoplastic adhesive for component attach is the focus of this paper. A design of experiments was conducted to identify processing conditions that maximize thermal conductivity, minimize electrical resistivity, and obtain adequate die shear strength. The loss of a transmission line on a Teflon based circuit board mounted with the thermoplastic adhesive was measured before and after temperature cycling. The thermoplastic adhesive was shown to be a promising candidate for component and circuit attach.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
