Abstract
This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper on the graphite flake and further spark plasma sintering of composite powders. The relative density of the composites with 44–71 vol.% flakes achieved up to 98%. Measured thermal conductivities and coefficients of thermal expansion of composites ranged from 455–565 W m−1 K−1 and 8 to 5 ppm K−1, respectively. Obtained graphite flake–copper composites exhibit excellent thermophysical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.
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