Abstract
The fundamental characteristics of the resist removal-cleaning system using cryogenic micro-solid nitrogen spray flow were investigated by a new type of integrated measurement technique. The present system utilizes the micro-solid nitrogen (SN2) which consists of the fine solid nitrogen particle produced by the high-speed collision of subcooled liquid nitrogen and the cryogenic gaseous helium (cryogen). According to present study, the effect of ultra-high heat flux cooling on the resist removal performance due to the rapid thermal contraction of resist material is clarified in detail. Furthermore, the effect of ultrasonic atomization of micro-solid nitrogen on ultra-clean performance of the wafer is newly founded.
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