Thermomechanical Analysis of Epidermal Electronic Devices Integrated With Human Skin

Abstract

Epidermal electronic devices (EEDs) are very attractive in applications of monitoring human vital signs for diagnostic, therapeutic, or surgical functions due to their ability for integration with human skin. Thermomechanical analysis is critical for EEDs in these applications since excessive heating-induced temperature increase and stress may cause discomfort. An axisymmetric analytical thermomechanical model based on the transfer matrix method, accounting for the coupling between the Fourier heat conduction in the EED and the bio-heat transfer in human skin, the multilayer feature of human skin and the size effect of the heating component in EEDs, is established to study the thermomechanical behavior of the EED/skin system. The predictions of the temperature increase and principle stress from the analytical model agree well with those from finite element analysis (FEA). The influences of various geometric parameters and material properties of the substrate on the maximum principle stress are fully investigated to provide design guidelines for avoiding the adverse thermal effects. The thermal and mechanical comfort analyses are then performed based on the analytical model. These results establish the theoretical foundation for thermomechanical analysis of the EED/skin system.