Thermo-hydraulic performance of electronic chip cooling through micro-channel heat sink with ribs and cavities on side wall

Abstract

Any electrical device's performance and lifespan improved by efficient cooling, overheating of electronic equipment causes damage of hardware and software. This study quantitatively examines the effects of rib and cavity configurations on heat transfer and fluid flow in a rectangular MCHS (Microchannel heat sink). Effect on thermo hydraulic performance of MCHS by increasing the number of ribs and cavities from 20 to 80 also has been checked. This investigation ranges the Reynolds number from 100 to 1000. Fluid flow and heat transfer governing equations solved for laminar, steady and three-dimension flow of fluid by using the finite volume method in Ansys Fluent. Thermal and hydraulic performance of MCHS with ribs and cavities is compared with plain channel (with no ribs and cavities on the side wall). By constructing the ribs on the side wall of MCHS the base plate temperature, pressure drop, heat transfer coefficient, Nusselt number, friction factor and thermal resistance are calculated. It is found that thermal performance of plain micro channel is increased by constructing the various shaped ribs and cavities on the side wall of micro channel. Thermal performance of micro channel has also increased by increasing the number of ribs and cavities on the side wall of micro channel heat sink. The numerical results show that minimum base plate temperature is observed at 80 square ribs on the side wall and minimum pressure drop at 60 square cavities on the side wall of MCHS.