Abstract
Energy-efficient, small and lightweight high-power light-emitting diodes (Hi-LEDs) are combined with a thermo-generation module (TGM) to transform the heat power generated by the LED into electric energy in the present paper. Variation in the dielectric copper and solder layer thickness in the printed circuit board (PCB) composite was found to affect the thermal performance of the Hi-LEDs lighting system, and a vapor chamber (VC) was shown to provide excellent heat dissipation performance when used with Hi-LEDs. Therefore, VC and PCB (VCPCB) were combined for integration with the Hi-LEDs package system (micro-generator with LED vapor chamber-based plate, LED-MGVC) for performance and illumination comparison. This study analyzes the performance of a novel LED-MGVC device using experimental and illumination-analysis methods with VCTM V1.0. Results depict that the LED-MGVC system provides significant improvement for thermal performance and illumination and thermoelectric properties.
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