Abstract
The preparation of thin film thermocouples by vacuum deposition is described. Combinations were made from Fe and CuNi alloy, evaporated by conventional heating resistance methods. Measurements of temperature against emf for these thermocouples gave almost bulk characteristic curves. The thickness dependence contribution to the Seebeck coefficient of Fe films is deduced from the thermal emf data on thermocouples formed with a 350 nm thick film of CuNi(58%Cu,42%Ni). It is compared with the size-effect theory based on the free-electron model, obtaining a maximum value of Seebeck coefficient of 0.058 mV °C−1, when the film thickness is greater than 250 nm. This value indicates that type J thin film couples can replace the wire without complications.
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