Thermoelectric MEMS coolers

Abstract

To date the advantages of solid-state coolers such as high reliability, low-mechanical noise, and localized temperature control have often been negated by their inefficiency and the frequent need for multiple stages to achieve the desired temperature difference. While recent research on novel materials and low-dimensional structures raises the hope for improved performance, additional innovations are required to make solid-state cooling competitive. MCC is developing a novel implementation and operational paradigm for solid-state coolers based on transient operation of thermoelectric (TE) coolers and micro-electro-mechanical switch (MEMS) technology. Application of a short transient pulse on top of a steady state bias to a correctly designed TE cooler results in a temporary additional temperature drop. MEMS switches can exploit this effect by providing a thermal switch between the cold end of the TE cooler and the device to be cooled, only connecting them during repeated transient pulses. The objective of this work is to demonstrate the feasibility of the TE MEMS cooler concept by fabricating a prototype and achieving a cold temperature lower than the one achievable by steady-state operation of a thermoelectric cooler. In this paper we describe the general concept and report on the progress made to date.