Abstract
A thermoelectric cooling device was used to cool a sealed instrumentation enclosure containing a single-board computer, I/O interface board and power conditioning module. The device was tested with all instrumentation components operating. Operating in a laboratory environment, the device provided sufficient cooling to keep the temperature inside the enclosure within 3.6C of the ambient temperature for ambient temperatures below 30.5C. When exposed to the outdoor environment with high ambient temperatures and direct sunlight, the cooling device was inadequate to maintain the desired enclosure temperature. Removal of the solar load by shading or reducing that load to less than 700 W/m2 resulted in acceptable performance by the cooling device, with enclosure temperatures maintained below 40 C.
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