Abstract
In this paper, the effect of voids, relaxation times, thermomechanical coupling, surface conditions, and plate dimensions on energy dissipation induced by thermoelastic damping in microelectronics mechanical systems (MEMS)/ nanoelectronics mechanical systems (NEMS) resonators are investigated. Closed form expressions for the transverse vibrations of a homogenous isotropic, thermoelastic thin plate with voids, based on Kirchhoff theory have been derived. The exact solutions for the free vibrations of plates under clamped-simply supported (CS) and simply supported-simply supported (SS) conditions are obtained. Analytical expressions for deflection, temperature change, frequency shifts, and thermoelastic damping in the plate have been derived. Some numerical results with the help of MATLAB programming software in case of silicon nitride and magnesium like material have also been presented.
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