Abstract
Understanding the energy dissipation mechanisms in single-crystal silicon MEMS/NEMS resonators are particularly important to maximizing an important figure of merit relevant for miniature sensor and signal processing applications: the Quality factor (Q) of resonance. This paper discusses thermoelastic dissipation (TED) as the dominant internal-friction mechanism in flexural mode MEMS/NEMS resonators. Criteria for optimizing the geometrical design of flexural mode MEMS/NEMS resonators are theoretically established with a view towards minimizing the TED for single-crystal silicon MEMS/NEMS flexural mode resonators.
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