Abstract
The reaction mechanism of the intermetallic compounds of SnxNdy and GaxNdy in the joint soldered with Sn–9Zn–1Ga–0.5Nd solder was investigated in order to evaluate the reliability of the soldered joint of Sn–9Zn–1Ga–0.5Nd. The results showed that the IMC of SnxNdy, which the compound may be induced the spontaneous growth of Sn whisker, could be substituted by GaxNdy, so that the risk of the growth of Sn whisker was eliminated. Thermodynamic calculation results showed the compounds of GaxNdy were much easier to form than those of SnxNdy which was adequately verified by SEM, EDS and XRD tests and analyses.
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