Abstract
The size dependence of melting temperature T m of metallic films (tin and copper) on different substrates, including amorphous carbon and another refractory metal (i.e., the dependence of T m on film thickness h) is investigated. It is found that the effect of the interfacial boundary can result in the growth of T m for thin metallic films on carbon substrates with a reduction in film thickness h. For a system with a metallic film on a metallic substrate, the size dependence of T m is less pronounced and T m falls with a reduction in h.
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