Thermoconductive Thermosetting Composites Based on Boron Nitride Fillers and Thiol-Epoxy Matrices.

Isaac Isarn,Francesc Ferrando,Angels Serra,Xavier Ramis

doi:10.3390/polym10030277

Isaac Isarn, Francesc Ferrando + Show 2 more

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https://doi.org/10.3390/polym10030277

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Abstract

In this work, the effect of the addition of boron nitride (BN) fillers in a thiol-cycloaliphatic epoxy formulation has been investigated. Calorimetric studies put into evidence that the kinetics of the curing has been scarcely affected and that the addition of particles does not affect the final structure of the network. Rheologic studies have shown the increase in the viscoelastic properties on adding the filler and allow the percolation threshold to be calculated, which was found to be 35.5%. The use of BN agglomerates of bigger size increases notably the viscosity of the formulation. Glass transition temperatures are not affected by the filler added, but Young’s modulus and hardness have been notably enhanced. Thermal conductivity of the composites prepared shows a linear increase with the proportion of BN particle sheets added, reaching a maximum of 0.97 W/K·m. The addition of 80 μm agglomerates, allowed to increase this value until 1.75 W/K·m.

Highlights

Nowadays, electronic and electrical industries have an increasing need to dissipate the heat of devices, which is produced by the Joule effect
Taking into account the improvement in thermal conductivity (TC) of thiol-epoxy materials and the need of a low viscosity of the reactive mixture, we proposed in the present work the use of a cycloaliphatic epoxy resin (ECC) with a commercial tetrathiol (PETMP) as the starting reactive mixture, filled with different proportions of boron nitride (BN) filler
In our research team reported for the first time the thermal curing of biscycloaliphatic epoxy previous Our publication, we showed that among other tertiary amine catalysts, DMAP was the most compounds by thiols in the presence of tertiary amines to form new thiol-epoxy thermosets [16]

Summary

Introduction

Electronic and electrical industries have an increasing need to dissipate the heat of devices, which is produced by the Joule effect This leads to a continuous demand of thermal conductive coatings and adhesives, with high electrical insulation capability. This demand is originated by the constant miniaturization, integration and functionalization of electronics and the appearance of new applications such as flexible electronics, light emitting diodes, etc. In this sense, heat management is of special interest in electronic components since they can be deserved for greater power output, improved efficiency and lengthening of half-life time and prevention of premature failures of devices [1]. Heat is directly related to the thermal conductivity (TC), and has been defined as the thermal energy transfer from a specific point to its surroundings due to the temperature gradient [3]

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