Abstract
This paper is an experimental study of thermocapillary breakdown phenomenon in a horizontal film of liquid placed on a silicon nonisothermal substrate. With the help of a high-speed video camera the speed of the three-phase contact line was measured during the growth of a dry spot.
Highlights
The modern industry often uses apparatus with liquid film flow
Thin liquid film is a promising approach for developing of cooling of devices with high local heat release, in particular, for high-end electronic chips [1,2]
The industry creates a need for cooling of high local heat fluxes from electronics components like computer chips, and power electronics
Summary
The modern industry often uses apparatus with liquid film flow. Thin liquid film is a promising approach for developing of cooling of devices with high local heat release, in particular, for high-end electronic chips [1,2]. The effect of substrate wetting and liquid properties on the thermocapillary breakdown of a falling liquid film was studied in [3,4,5]. The paper [6] studied the effect of substrate structuring on phenomenon of falling liquid film breakdown. The papers [4, 10] demonstrated that the critical heat flux for the case of horizontal liquid films is by several times higher than the critical level for gravity-driven liquid films. This explains the relevance of the present study
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