Abstract
Methyl silicone resins, (CH 3SiO 1.5) n, containing alkoxy and hydroxy end groups are cured by heating. It will be shown that thermal analysis is a helpful tool to investigate curing conditions and pyrolytic decomposition in silicone resins, e.g. in Wacker Silicone Resin MK. DSC, TG/DTG and EGD measurements in air und N 2 up to 1000°C were conducted and the formed products analyzed with the help of IR, GLC and 1H/ 29Si/ 13C NMR. The composition and structure of the uncured and cured resin and of the solid residues obtained by heating to 1000° C in air or N 2 will be discussed.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
