Abstract
The sequential thermal-mechanical coupling analysis which solves in turn the transient temperature field and subsequent thermomechanical deformations was performed in this work to investigate thermal characteristics along with fatigue reliability of a thin-profile fine-pitch ball grid array chip-scale package under power cycling. The numerical model was calibrated using steady-state and power cycling experiments. Following the calibrated numerical model, different power cycling durations on the thermal characteristics and fatigue reliability of the solder joints were examined.
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