Abstract
This paper describes a novel transient liquid phase sinter (TLPS) bonding that utilizes Sn-coated micro-sized Cu particles for high-temperature power device packaging. When used as die attach materials for Cu–Cu bonding, a thermally stable joint comprising a Cu3Sn intermetallic compounds (IMCs) with a dispersion of ductile Cu particles was obtained after bonding at 300°C for 30s, and a shear strength equivalent to that of conventional Pb–5Sn solder could be achieved. After isothermal aging at 300°C for 200h, the shear strength and microstructure of the bonding joints were almost unchanged.
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