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Abstract
Results on copper metallization diffusion barriers using high-entropy alloy (HEA) nitride are reported. The HEA nitride (AlMoNbSiTaTiVZr)50N50 is amorphous in the as-deposited state and remains its noncrystallinity up to a high temperature of 850°C. To evaluate its diffusion barrier characteristics, Cu∕(AlMoNbSiTaTiVZr)50N50∕Si test structures were prepared and annealed under 750–900°C for 30min. The results show that the current nitride prevents the reaction between Cu and Si before its failure at 900°C. The outstanding barrier performance and high thermal stability of amorphous structure are suggested to originate from multiprincipal-element effects.
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