Thermally resistant photocrosslinked damping poly(phenylene oxide)–fluorosilicone rubber films with broad and high effective damping temperatures

Abstract

ABSTRACTThe development of an energy‐efficient strategy to prepare thermally resistant damping materials with high damping capacities (tan δ values) and broad effective damping temperature ranges (ΔTs) at high temperatures (>150 °C) is still an interesting challenge. In this study, a graft copolymer (PSi‐g‐APPO) was synthesized through the reaction between hydrogen‐terminated fluorosilicone and allyl poly(phenylene oxide) (APPO), and a unique kind of photocrosslinkable film (coded as GFA) consisting of FSR, APPO and PSi‐g‐APPO was prepared. The resultant GFA has high thermal resistance, wide ΔT, and high tan δ. When the weight ratio of APPO to FSR to PSi‐g‐APPO was 81:9:10, the obtained film exhibited a broad ΔT of 64 °C and a high tan δ (≤1.01) from 157 to 221 °C; this was the best comprehensive performance among the GFA systems. The mechanism behind the excellent integrated performance of GFA was studied and was proven to be due to the unique structure of the heterogeneous GFA system. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47231.