Abstract
SummaryNanocomposite of thermally conductive adhesive was prepared from cellulose‐based adhesive, TSA‐doped Ppy and ceramic filler via colloidal dispersion. Field emission scanning electron microscopy (FESEM), thermogravimetric analysis (TGA) and differential scanning colorimetry (DSC) were used to characterize the nanocomposites. Electrical and thermal conductivity were measured by using frequency response analyzer and thermal analyzer, respectively. Results showed that the prepared thermally conductive adhesive was stable at relatively high temperature. The electrical conductivity found for the nanocomposite was in the range of semi conductive region. Meanwhile, the thermal conductivity was higher than the conventional polymer.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
