Abstract
A 3D filler network structure can significantly improve the thermal conductivity of a composite. In addition, a spherically shaped filler is advantageous for high packing density and filler connectivity compared to other shapes. Here, to achieve a high thermal conductivity, epoxy composites were fabricated using spherically aggregated boron nitride (A-BN) and Cu foam as hybrid fillers. To defoam the composites, A-BN was first incorporated into the matrix with Cu foam by a vacuum impregnation process, followed by a curing process. As the A-BN loading increased up to 25 wt%, the thermal conductivity of the composite also increased due to the formation of a heat path. However, when the filler loading exceeded 25 wt%, the thermal conductivity decreases because of filler aggregation. Thus, the composite containing 25 wt% A-BN exhibited the maximum thermal conductivity (2.017 W/mK), with an enhancement of 940% compared with that without filler. In addition, the incorporation of A-BN is beneficial for increasing the volume resistivity of the composite, allowing its practically insulation (1.21 × 1013 Ω cm). This study shows that the formation of 3D network structures with binary fillers is advantageous for the heat management of electronic devices.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.