Abstract
AbstractShape memory epoxy with self‐healing ability has received much more academia and industry attention. In this work, 4‐aminophenyl disulfide containing disulfide bonds was used to replace the traditional epoxy resin‐curing agent, and the waterborne epoxy resin (sWEP) was composited with the polydopamine (PDA) nanoparticles with photothermal conversion effect through the melt mixing and hot‐press molding. As revealed, the addition of 1 wt% PDA increases the tensile strength of sWEP from 36.1 to 50.3 MPa. Specifically, the shape memory properties of the PDA/sWEP composite as manifested by a ca. 97.4% shape memory fixing ratio and ca. 67.8% shape memory recovery ratio. Moreover, the PDA/sWEP composite had the temperature‐dependent thermosetting and thermoplastic conversion capabilities, which can be programmed to a new permanent shape via a photothermal‐induced plasticity process.
Published Version
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