Thermal Transient Measurements on High Power LEDs with Different MCPCB Substrate

Abstract

This study elucidates the significance of thermal transient measurement based on structure function evaluation particularly on high power LEDs. The metal core printed circuit boards (MCPCBs) were redesigned with reference to the product datasheet. Aluminium nitride was employed as the dielectric material of the MCPCBs and thermal performance of copper and aluminium substrate with different substrate thickness has been reported in this paper. It was observed that the aluminium based MCPCBs performed better heat dissipation compared to the copper based MCPCBs. In addition, when two different thicknesses of the MCPCB substrates were compared, it was observed that the thicker substrate performed a lower thermal resistance compared to the thinner substrate MCPCB. The junction to board thermal resistance was determined using the standard transient dual interface method.