Thermal testing and numerical simulation of gypsum wallboards incorporated with different PCMs content

Abstract

A mathematical model based on the Fourier heat conduction equation for one dimension was developed. The complexity of the mathematical solution of this stiff set of differential equations that use boundary conditions that move with the solid–liquid interface was simplified by using an apparent heat capacity ( c p ap ) dependent on temperature and obtained by Modulated Differential Scanning Calorimetry (MDSC). The performance of this model was confirmed by using a home-made experimental installation for the thermal characterization of solid materials. Theoretical curves obtained for gypsum blocks with three different contents of phase change materials (PCMs) were in agreement with experimental ones, indicating that this thermal process can be reproduced theoretically by using the c p ap of each block and a unique thermal conductivity of the pure gypsum. The other physical and thermal properties were taken from literature or supplied by the manufacturers. Results also indicated that the higher the PCM content, the higher the energy storage capacity of the wallboard and the lower the wall temperature variation. Furthermore, it was found that a block containing a 5 wt.% of microcapsule allows the reduction of gypsum thickness by 8.5%, maintaining the same insulating effect. Thus, these kind of material can be used to improve comfort, save energy in buildings and even reduce the weight of wallboards.