Thermal Testing and Analysis Techniques for Wires and Wire Bundles

Abstract

Determining wire and wire bundle amperage capacity (i.e., “ampacity”) currently relies on the use of standards to derate wire ampacity when in a bundle configuration. The feasibility of developing physics-based and regression thermal models of single wires and wire bundles to determine ampacity using a customized test apparatus was investigated during a pathfinder study. A test facility was developed and various wire and wire bundle articles were tested under a variety of temperature and pressure conditions using an efficient test matrix formulated using Design of Experiments (DOE) techniques. Physics-based models were developed and correlated to the test results. Regression models were formulated and compared to test results and standards.