Abstract

At present, the thermal switch for localized heating is becoming a hot research topic in MEMS packaging technology. A method of using a liquid-based thermal switch is proposed in this paper. A plate local heating device based on electric field distribution control is constructed, where a thermal liquid column can be formed under the action of the electric field. The electric field controls the formation and dissipation of the liquid column to realize the on-off and off-on function of the thermal switch. Through the control of the different conductive substrates in the plate, the localized heat transfer can be further realized, and the heat transfer position is precisely regulated. Furthermore, due to the fluidity of the liquid, the prepared thermal switch can also realize movable heating. The experimental results show that the heating time and speed can be controlled precisely by adjusting the driven voltage and the conductive area of the upper substrate.

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