Thermal stresses factors of orthotropic graded layers with a finite line bond

Abstract

In the paper, the problem of a finite line bond between two orthotropic functionally graded strips under thermal loading is considered. Considering some new boundary conditions, it is assumed that the temperature drop across the finite line bond is the result of the thermal conductivity index controlling heat conduction through the bond region. Using Fourier transforms technique, the therm-elastic mixed boundary value problems are reduced to a system of singular integral equations which can be solved approximately by applying the Chebyshev polynomials. The numerical results for the temperature and displacement field as well as the thermal stress intensity factors (TSIFs) are presented. The influence of the thickness of the layers and the thermo-elastic nonhomogeneity parameters on the temperature distribution and the TSIFs is discussed in detail. These results can be expected to be used for the purpose of gaining better understanding of the thermo-mechanical behavior of layered structures.