Abstract
This paper reports on thermal strain analysis of integrated circuit (IC) packages using the optical, atomic force microscope (AFM), and scanning electron microscope (SEM) Moiré methods. The advantages and disadvantages of a full field optical Moiré, a micro‐optical Moiré, AFM Moiré, and SEM Moiré methods are compared. The full field Moiré interferometry is used to investigate the deformations and strains induced by thermal loading in various packages at the macrolevel. The micro Moiré interferometry is used to study the strains in the small solder joints. An optical Moiré interferometer with a mini thermal‐cycling chamber can be used for real time measurements of thermal deformations and strains of IC packages under thermal testing. Furthermore, the novel methods, AFM Moiré and SEM Moiré, can be also utilized to measure thermally induced deformations and strains of IC packages conveniently using the equipment that is commonly and primarily used for many other applications.
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