Thermal state of electronic assemblies equipped with an array of heaters and coolers (HACs) subjected to natural convection

Abstract

In this study, the thermal state of microelectronic assemblies equipped with an array of heaters and coolers (HACs) subjected to the natural convection is described. According to the intended electronics application, a 3×3 array of distinct heat sources and a 2×2 array of distinct coolers are connected on one perpendicular wall of the rectangular module. The rectangular enclosure is entirely occupied by porous material permeated with a water-Cu nanofluid. The Brinkman and Forchheimer extended Darcy flow model is employed to model the fluid flow within the porous material. 3D Navier-Stokes and energy equations are solved numerically based on the finite volume discretization technique. Thermal state and flow field are analyzed, regarding the wide range of considered parameters namely, the Darcy number, the rectangular module side aspect ratio, the Rayleigh number and the nanoparticles volume fraction. The outcomes expose that the overall Nusselt number intensifies by mixing the Cu powder nanoparticles into the base fluid and with an increase in the Rayleigh number. The heat transfer attains its maximum when the side aspect ratio of the module assumes values between 1.5 and 2. This work helps to improve thermoregulation of electronic assemblies via nanofluid saturated porous media.