Abstract

The thermal stability of a SiGe/Si quantum well grown by molecular-beam epitaxy is studied by using the admittance spectroscopy technique. The values of activation energies of hole emission from the subbands in the SiGe/Si quantum well are derived from the admittance spectra. After annealing the sample at different temperatures, the activation energy varies in different behaviors. There is no significant change of the activation energy after annealing at 700 °C for 40 min. At the annealing temperature of 900 °C, the decrease of the activation energy with annealing time could be attributed to the interdiffusion of Ge, Si atoms at the heterointerfaces and the strain relaxation effect. An unexpected phenomenon is observed at the annealing temperature of 800 °C, i.e., the activation energy increases with the annealing time. This extraordinary phenomenon is supposed to be caused by the change of the well potential shape due to the B out-diffusion from the well to the Si barrier.

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