Abstract
The thermal stability of layers grown by Si-molecular beam epitaxy is reported in a comparative study of strain induced in Si by heavy B doping and by Si1-x Gex alloying. High-resolution X-ray diffraction mapping was employed as the major analytical tool. The strain relaxation under high-temperature annealing is shown to be dominated by the formation of precipitates and by diffusion in the case of heavy doping but with a negligible amount of dislocations. In the Si1-x Gex /Si heterostructures, the process is dominated by strain relaxation via formation of misfit dislocations.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
