Abstract
Abstract Thermal spray coatings are used for a broad range of purposes in the semiconductor equipment industry. A primary use of thermal spray coatings for thin film applications is to provide surfaces on process chamber components that promote particle reduction and contamination control during chamber operations. Coatings are also used to provide the desired dielectric properties for critical components such as electrostatic chucks (ESC) and heater pedestals; to prove chemical and corrosion-resistance for process kit components and showerheads; as well as serving a wide range of other purposes. This paper reviews future needs for thermal spray coatings in semiconductor equipment and identifies some of today’s coating challenges. Areas discussed include coating design considerations; chemical, corrosion and plasma erosion issues influencing the selection of materials, coatings and processes. Brief discussion will be provided for future anticipated needs in materials, coatings, processing and the manufacture of thermal spray coatings for such applications.
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