Abstract
Heat loss from the pyroelectric element to the silicon chip is the reason for the lower sensitivity of integrated pyroelectric sensors compared to discretely assembled single element sensors. A possible measure to overcome this drawback of the sensor performance is the fabrication of micromachined bridges on the top surface of an integrated circuit as the support for a pyroelectric film. A relaxation procedure is given as a tool for a detailed thermal modelling, which allows to estimate the sensor performance and to optimize the thermal parameters. Examples for the thermal sensor design are presented. The performance of pyroelectric sensors, which can be achieved by means of appropriate micromachined bridges, is discussed.
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