Abstract
This work presents an algorithm for simulating more accurate temperature distribution in two-phase liquid cooling for three-dimensional integrated circuits than the state of-the-art methods by utilizing local multi-linear interpolation techniques on heat transfer coefficients between the microchannel and silicon substrate, and considering the interdependence between the thermal conductivity of silicon and temperature values. The experimental results show that the maximum and average errors are only 9.7% and 6.7% compared with the measurements, respectively.
Highlights
Due to the high power density and the ill of heat dissipation capability, the operating temperature of three-dimensional integrated circuits (3-D ICs) is higher than that of two-dimensional (2-D) ICs
The experimental results show that the maximum and average errors are only 9.7% and 6.7% compared with the measurements, respectively
The microchannels are etched in the silicon substrate in advance
Summary
Due to the high power density and the ill of heat dissipation capability, the operating temperature of three-dimensional integrated circuits (3-D ICs) is higher than that of two-dimensional (2-D) ICs. Recently, to effectively remove the heat in 3-D ICs, the advanced liquid cooling system has been widely discussed [1]. Reference [3] discretized microchannels into small grids to propose a steady state thermal model for single-phase liquid cooling 3-D ICs. Four extra nodes are added, and a channel merging technique is used to simulate the complicated thermal-wake effect of liquid cooling. 3D-ICE, a compact transient thermal model was proposed in Ref.
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