Abstract
This paper shows that thermal characterization of TO-66 and TO-220 package transistors in avionics module using the thermal transient measurement method and simulation. To determine the thermal resistance values of the junction-to-case (RthJC), the JEDEC JESD 51-14 transient dual interface measurement method is a well-known and industry-wide accepted technique. In this article we also show a thermal model calibration tasks using transient thermal measurement. A detailed package model calibrated will allow even more accurate thermal simulations and improve the reliability of components.
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