Abstract
AbstractNiFe/Cu multilayer stacks of 2 nm single layer thickness were deposited onto needle‐shaped W tips by ion beam sputtering and analysed by atom probe tomography (TAP) after appropriate heat treatments. After annealing at 250 °C for 30 min, no significant structural or chemical transformation of the initial layer system is detected, although such a heat treatment appreciably reduces the magneto resistivity. A slight decrease of the concentration slope at the interfaces is attributed to a very short‐range interdiffusion. Clear grain boundary diffusion is observed after annealing at 400 °C for 30 min. Further annealing at 500 °C for 20 min and 40 min still preserves the layered structure with a homogeneous solution of Ni inside the Cu layers of up to 25 at.% Ni. Copyright © 2007 John Wiley & Sons, Ltd.
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