Abstract
Ensuring reliability of data on thermal properties of wood-based panels is important for manufacturing processes, especially when it is recommended to shorten the cooling phase and stack the panels in hot conditions. Prediction of the heat transfer during cooling phase and normal or hot stacking based on accurate data is essentially important for attaining panels of required properties. The thermal properties are also required when designing houses, especially low-energy or passive ones. Therefore, a water calorimeter was adequately designed and constructed to ensure improvement in the accuracy of the specific heat measurements. The calorimeter was used to determine the specific heat. The attained accuracy estimated by the relative error was significantly increased, and the error values were less than 2 % for all types of the investigated particleboard and OSB. In case of low-density fiberboard (LDF), the maximum value of the relative error did not exceed 4 %. It was also shown that high accuracy required for the specific heat measurements was achieved for experiments in which high-mass samples were used, in contrast to measurements for such samples in traditional DSC systems. The results for the specific heat were within the range from 1420 to 1450 J/kg K for LDF and all types of particleboard. The effect of the investigated material density on the specific heat was not found. The only exception was in case of OSB for which the specific heat was ca. 1550 J/kg K, and it was approximately 100 J/kg K higher when compared to other panels.
Highlights
Credible data on thermal properties of wood-based panels are of special significance during manufacturing processes, e.g., for controlling the cooling phase which is required before stacking materials already produced
The only exception was in case of OSB for which the specific heat was ca. 1550 J/kg K, and it was approximately 100 J/kg K higher when compared to other panels
The designed and constructed calorimeter enabled to perform measurements of the specific heat of wood-based panels with accuracy estimated by the relative error being less than 2 % for all types of the investigated particleboard and OSB
Summary
Credible data on thermal properties of wood-based panels are of special significance during manufacturing processes, e.g., for controlling the cooling phase which is required before stacking materials already produced. The accurate prediction of heat transfer during cooling phase as well as during normal or hot stacking has special importance for obtaining the required properties of the panels. High accuracy of thermal properties of wood-based panels is required when designing houses, especially low-energy or passive ones. The phenomenon is usually associated with water condensation at surfaces with low temperature. It results in dramatic decrease in insulating properties of the materials due to increase in their moisture content. The process is self-propelling as the increase in moisture content causes further increase in thermal conductivity of the materials
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
