Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

Mazlan Mohamed,Mohd Nazri Omar,Mohamad Shaiful Ashrul Ishak,Rozyanty Rahman,Zaiazmin Y.N,Zairi Ismael Rizman

doi:10.14419/ijet.v7i4.33.28169

Abstract

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO). The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.

Highlights

Thermal management in electronic industry has become crucial especially in removing the heat flux generated from the chip to the heat sink [1]
In order to verify the accuracy of measured thermal conductivity, the modified Maxwell–Garnett effective medium approximation (EMA) [18] and Xie's model [19] are applied to compare with the experimental The experimental results are obtained at room temperature 20 °C and epoxy was used as based material and has thermal conductivity of 0.3 W/(mK)
A few procedure has been implement in order to enhance the thermal conductivity of graphene-epoxy composite

Summary

Introduction

Thermal management in electronic industry has become crucial especially in removing the heat flux generated from the chip to the heat sink [1]. After the discovery of the graphene which has the highest thermal conductivity, many researchers start to study the effect of filling graphene to the thermal interface material start with study of composite between thermal grease with small portion of graphene. It was proven thermal grease fill with 4.25 vol % graphene was able to increase 668% thermal conductivity up to 1.047W/mK from 0.156 W/mK [12]. The effect of graphene with different weight percentage on thermal conductivity are all measured and studied to discover the most suitable graphene filling fraction for graphene-epoxy composite thermal interface material, to improve thermal conductivity in electronic application especially in heat sink application

Methods

Results

Conclusion