Abstract
Abstract: The thermal properties of a micro‐electromechanical system sensor were analysed by a novel digital moiré method. A double‐layer micro‐cantilever sensor (60 μm long, 10 μm width and 2 μm thick) was prepared by focused ion beam milling. A grating with frequency of 5000 lines mm−1 was etched on the cantilever. The sensor was placed into a scanning electron microscope system with a high temperature device. The observation and recording of the thermal deformation of the grating were realised in real‐time as the temperature rose from room temperature to 300 °C at intervals of 50 °C. Digital moiré was generated by interference of the deformed grating and a digital virtual grating. The thermal properties including strain distribution of the sensor and the linear expansion coefficient of polysilicon were accurately measured by the phase‐shifted moiré patterns.
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