Thermal properties and thermal degradation kinetics of phenolic and wood flour-reinforced phenolic foams

Abstract

In the present work, the thermal stability, changes in chemical structure during thermal degradation, and the kinetics of thermal degradation of a phenolic foam were studied. An 8.5 wt% of Pinus radiata wood flour reinforcement was added to the phenolic foam. A commercial phenolic resol was used as the matrix for the foam. The wood flour-reinforced foam showed a structure similar to the phenolic foam according to the Fourier transform infrared spectroscopy results. The wood flour increased the thermal stability of the phenolic foam in the first stage of thermal degradation ( T5%), decreased it in the second step ( T25%), and negligibly influenced the final stage. The activation energies of the degradation processes of the studied materials were obtained by the Kissinger-Akahira-Sunose and Flynn-Wall-Ozawa model-free kinetic methods and a 2-Gaussian distributed activation energy model. The values of the activation energies obtained by the model-free kinetic methods for the first degradation stage of the phenolic foams were in a range between 110 and 170 kJ mol−1, whereas for the wood flour it was 162 kJ mol−1for almost all of the conversion range of its main degradation stage. The applied models showed good fits for all the materials, and the activation energies calculated were in agreement with the values found in the literature.