Abstract

Aims and objectives:: The aim of this study was to fabricate epoxy resin-based hybrid composites reinforced with biodegradable Millettia pinnata leaf powder in conjunction with glass sheets, boron nitride, and alumina for the production of printed circuit boards. Method:: For this application, various thermal, physical, and electrical tests were conducted by the authors. The thermal test results showed that the alumina-based epoxy hybrid composite has more thermal stability than the neat epoxy. Moreover, upon adding BN/Alumina, the flame retarding properties of the epoxy hybrid composites improved. We also observed that with the increase in the content of BN and alumina, the thermal conductivity of the hybrid composite was enhanced. From the water absorption tests, the hybrid composite with 6g BN showed the least amount of water consumption. Particularly, adding BN and leaf powder from 2 to 6 g gave better results for the decrease in water absorption, as compared to adding alumina in the epoxy-based hybrid composite. Result:: Lastly, from the electric tests, we observed that with the increase in frequencies, the dielectric constant of the hybrid composite decreases. At a lower frequency range, the hybrid composite having 2g of BN and millettia pinnata leaf powder shows the lowest dielectric constant, whereas, at a higher frequency range, 2g of alumina and millettia pinnata leaf powder shows the lowest dielectric constant. Conclusion:: We predict that the results reported in this investigation will aid in accelerating the engineering applications of epoxy resin-based hybrid composite materials and help patent the material compositions for specific purposes.

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