Abstract
This paper presents thermal performance of shape-stabilized phase change material (PCM) wallboards and common wallboard. Shape-stabilized PCMs consist of paraffin and high-density polyethylene as support materials. The wallboards were prepared by shape-stabilized PCMs and grout with the building materials in mass proportions of 5%, 10%, and 15%. The phase change temperature of the shape-stabilized paraffin was 27.5 °C and the maximum content of paraffin in the shape-stabilized PCM was 70%. The energy-saving effect and feasibility of shape-stabilized PCM wallboard were compared with those of ordinary wallboards. The results showed that prepared PCM wallboard has good thermal performance and thus it has high potential for the cooling of buildings.
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