Thermal performance of copper vapor chamber with double-sided uniform radial micro-grooved wicks by laser fabrication

Yongchao Wang,Xin Wei,Guohao Zhang,Yuanke Li,Zhengfa Hu,Lei Wang,Liang Zhang

doi:10.1063/5.0060145

Abstract

In order to ensure the reliability of high heat-flux electronic devices, vapor chambers with double-sided uniform radial micro-grooved wicks (DURM) are developed. The driving force model of the working liquid inside the DURM vapor chamber is established. To enhance the driving force of the working liquid, the condensation micro-grooves and evaporation micro-grooves of the DURM vapor chamber are fabricated using an ultraviolet laser and an infrared laser, respectively. In addition, the startup characteristics and temperature uniformity of the DURM vapor chamber and the effect of the depth–width ratio and radiation angle of the micro-grooves and the filling ratio of the DURM vapor chamber on its thermal performance are also investigated. The results indicate that the DURM vapor chamber could maintain good temperature uniformity. Both the evaporation micro-grooved and condensation micro-grooved wicks facilitate the enhancement of the thermal performance of the vapor chamber. The double-sided micro-grooved wick with a larger depth–width ratio and a smaller radiation angle improves the thermal performance of the DURM vapor chamber. However, when the radiation angle is lower than 4°, further reducing the radiation angle has little effect on improving the thermal performance. In addition, an appropriate filling ratio helps reduce the thermal resistance of the vapor chamber under a certain heat load.

Highlights

With the increasing integration of electronic devices, the thermal management of electronic devices is faced with great challenges.1,2 In order to ensure the reliability of high heat-flux electronic devices, such as Li-ion EV batteries,3,4 high-intensity light-emitting diodes (LEDs),5,6 and printed circuit boards (PCBs)7,8 with multiple high-power chips, it is necessary to design an efficient heat spreader to lower their temperature
The evaporation micro-grooved wick is more effective compared with the condensation micro-grooved wick
Vapor chambers with double-sided uniform radial micro-grooved wicks are developed by laser fabrication

Summary

Introduction

With the increasing integration of electronic devices, the thermal management of electronic devices is faced with great challenges. In order to ensure the reliability of high heat-flux electronic devices, such as Li-ion EV batteries, high-intensity light-emitting diodes (LEDs), and printed circuit boards (PCBs) with multiple high-power chips, it is necessary to design an efficient heat spreader to lower their temperature. Heat pipes and vapor chambers utilize the latent heat of the working fluid to transport the heat from the heat source to the condenser, which have proven to be the most effective passive cooling devices. The heated working fluid is converted into the vapor phase, which spreads in the entire chamber and condenses at the top of the vapor chamber. Compared with the one-dimensional heat pipe, the vapor chamber makes it possible to have a more uniform temperature distribution over a large surface.. The vapor chamber has been successfully applied in Li-ion EV batteries, high-intensity light-emitting diodes (LEDs), and other fields due to its uniform temperature distribution, large condensation area, lightweight, and flexible manufacturing Compared with the one-dimensional heat pipe, the vapor chamber makes it possible to have a more uniform temperature distribution over a large surface. The vapor chamber has been successfully applied in Li-ion EV batteries, high-intensity light-emitting diodes (LEDs), and other fields due to its uniform temperature distribution, large condensation area, lightweight, and flexible manufacturing

Methods

Results

Conclusion