Abstract
NuBGA is a low‐cost, single‐core, two‐metal layer, cavity‐down plastic ball grid array package. With special design concepts, NuBGA provides electrical and thermal enhancements for electronic packaging applications. The concepts of these innovative designs are briefly described. Thermal resistance of junction to air is investigated first by finite element simulations, and the results are then compared to experimental measurements. Also, thermal measurements are carried out for both with, and without, heat sink attachment. Geometric dependence of thermal resistance on structural parameters such as thickness of the copper heat spreader and organic substrate, power and ground planes in printed circuit board (PCB), and the size of PCB are also discussed.
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