Thermal performance investigation of MMC heat sinks for low CTE electronic components cooling

Abstract

From the past decades, a vast amount of research is going on to find the cooling solutions for electronics involving numerous applications. In various sectors such as CPU coolers, LED coolers, relay cooling systems, battery cooling systems, aviation electronic components cooling systems, etc. The major problem involving electronic components cooling is the design of heat sinks and their compatibility with the electronic components for the specified applications. Also, the fast-paced advancements in computing leading for the creation of high-performance processors with integrated and complex circuits for which the cooling became a difficult task which is challenging the present market. This study aims at developing a metal matrix composite (MMC) heat sink for low coefficient of thermal expansion (CTE) electronic components cooling. Three groups of Al, SiC, and AlN are used to prepare three MMC prototype heat sinks. The mechanical and thermal properties of prototype combination MMC specimens were evaluated experimentally. The performance enhancement investigations on the prototype heat sinks were carried out in an insulated rectangular duct under forced convection at a constant heat flux of Q = 60 W and at 28°C, 101.325 kPa ambient conditions. The experiment is carried out at wind velocities ranging from 1 m/s to 4 m/s with an interval of 0.5 m/s. Results show that for GIIC MMC prototype heat sink the thermal resistance was significantly reduced by 35.25% on average and for every 1 W of pumping power the thermal resistance was decreased by 1.056% on average.From the past decades, a vast amount of research is going on to find the cooling solutions for electronics involving numerous applications. In various sectors such as CPU coolers, LED coolers, relay cooling systems, battery cooling systems, aviation electronic components cooling systems, etc. The major problem involving electronic components cooling is the design of heat sinks and their compatibility with the electronic components for the specified applications. Also, the fast-paced advancements in computing leading for the creation of high-performance processors with integrated and complex circuits for which the cooling became a difficult task which is challenging the present market. This study aims at developing a metal matrix composite (MMC) heat sink for low coefficient of thermal expansion (CTE) electronic components cooling. Three groups of Al, SiC, and AlN are used to prepare three MMC prototype heat sinks. The mechanical and thermal properties of prototype combination MMC specimens were evaluated ...