Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load

Abstract

PurposeThis paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly are provided.Design/methodology/approachThe POP stacked chip assembly which contains different package structure mode and chip position was manufactured. The fatigue characteristics of POP stacked chip assembly under thermal cycling load were tested. The fatigue load spectrum of POP stacked chip assembly under thermal cycling load was given. The fatigue life of chips can be estimated by using the creep–fatigue life prediction model based on different stress conditions.FindingsThe solder joint stress of top package is significantly less than that of bottom solder joints, and the maximum value occurs in the middle part of the solder joints inner ring.Originality/valueThis paper fulfils useful information about the thermal reliability of POP stacked chip assembly with different structure characteristics and materials parameters.